Yesterday we posted some information to our
blog about an upcoming Webinar you may be interested in. In case you missed it, we are forwarding the same info here.
On Thursday, July 17th, Mechanical Engineering and COMSOL will give a free webinar on
"Simulation of Thermal-Structure Interaction."
Details and registration are available below.
Live Presentation - Thursday, July 17th, 2014, 2:00pm EDT
Speakers:Kyle C. Koppenhoefer from AltaSim
Technologies
Shankar Krishnan, Applications Engineer, COMSOL
Multiphysics simulation can be used to model thermal-structure interaction and involves coupling structural analysis and heat transfer. One application includes simulating thermal expansion in order to analyze thermally induced stresses in electronics, MEMS devices, and machineries. In this webinar we will cover related topics, including thermal and mechanical contact. We will explore features of
COMSOL Multiphysics
(R) that are needed for solving thermal-structure interaction problems. The webinar will include
a live demonstration showing how to set up such a problem, and will conclude with a Q&A session.
For more information and to register, visit:
